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Welcome

WELCOME TO

ECIE 2027

Xi'an, China | May 28-30, 2027

2027 7th International Conference on Electronics, Circuits and Information Engineering

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about

About ECIE 2027

The ECIE 2027 conference aims to gather professors, researchers, scholars and industrial pioneers all over the world. ECIE is the premier forum for the presentation and exchange of past experiences and new advances and research results in the field of theoretical and industrial experience. The conference welcomes contributions which promote the exchange of ideas and rational discourse between educators and researchers all over the world. The organizing committee of conference is pleased to invite prospective authors to submit their original manuscripts to ECIE 2027.

date

Important Dates

Full Paper

Submission Date

March

11

2027

Notification of

Acceptance Date

April

11

2027

Final Paper 

Submission Date

April

27

2027

Conference

Dates

May

28-30

2027

Supported by

Sponsor

西北工业大学logo.png
other

☛ Call For Papers

☛ Submission

☛ Publication


Call ForPapers

The topics of interest for submission include, but are not limited to:

📚︎Electronic Circuits, Devices and Systems

Digital and analog circuits and systems, VLSI design and manufacturing, Semiconductor devices and integrated circuits;

📚︎Power Electronics, Electrical Systems and Energy Technologies

Power electronic converters and systems, Power semiconductor devices and applications, Electric machines, drives and control;

📚︎Industrial Automation, Control and Intelligent Systems

Industrial automation and control systems, Intelligent control and optimization, Robotics and mechatronics;

📚︎Sensing, Instrumentation and Signal Processing

Sensors and actuators, Measurement and instrumentation technologies, Sensor networks and intelligent sensing;

📚︎Communication Networks and Wireless Technologies

Wireless communication and networking, Antenna systems, propagation and RF design, Microwave electronics and electromagnetics;

📚︎Intelligent Information Technologies and Emerging Applications

Artificial intelligence and machine learning, Parallel and distributed computing, Intelligent information systems;

Submission

1. The submitted papers must not be under consideration elsewhere.

2. Please send the full paper (Word+PDF) to Submission System.

📤︎Submission System (CN)📤︎Submission System (EN)

3. Please submit the full paper, if both presentation and publication are needed.

4. Please submit the abstract only, if you just want to make presentations.

5. Download Templates:

📥︎Download

6. Should you have any questions or need any materials in English, please contact us.

contact_ecie@163.com

Publication

ECIE 2026 |IEEE Xplore丨EI Compendex丨Scopus

ECIE 2025 |IEEE Xplore丨EI Compendex丨Scopus

ECIE 2024 |IEEE Xplore丨EI Compendex丨Scopus

ECIE 2023 |EI Compendex丨Scopus

ECIE 2022丨EI Compendex丨Scopus

ECIE 2021丨IEEE Xplore丨EI Compendex丨Scopus


All accepted full papers will be published in the conference proceedings and will be submitted to EI Compendex / Scopus  for indexing.

Note: All submitted articles should report original research results, experimental or theoretical, not previously published or under consideration for publication elsewhere. Articles submitted to the conference should meet these criteria. We firmly believe that ethical conduct is the most essential virtue of academics. Hence, any act of plagiarism or other misconduct is totally unacceptable and cannot be tolerated.

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