The 2021 International Conference on Electronics, Circuits and Information Engineering
About

International Conference on Electronics, Circuits and Information Engineering(ECIE 2021)will be held during January 22-24, 2021. ECIE2021 is an international forum for scientists, engineers, and practitioners to present their latest research and development results in all areas of Electronics, Circuits, and Information Engineering. Conference topics mainly include but are not limited to Digital electronics, Analogue Electronics, Microelectronics, Circuit design, Integrated circuits, Optoelectronics, Semiconductor devices, Embedded systems and Information Engineering, etc. ECIE 2021 welcomes all high-quality research papers and presentations from related research fields. 


For more topics, please refer to Call for Papers.


Important Dates

Full paper Submission Due: Jan. 18, 2021

Abstract Submission Due: Jan. 18, 2021

Decision Notification: 5-7 working days after submission

Attendees Registration Due: Jan. 22, 2021


Publication

IEEE-CS-CPS.jpg

All accepted full papers will be published by IEEE CS and will be submitted to EI Compendex, Scopus for indexing. 

-----------------------------------------------------------------------------------------------------------------------------------------------------------------------

Note: All submitted articles should report original, previously unpublished research results, experimental or theoretical. Articles submitted to the conference should meet these criteria and must not be under consideration for publication elsewhere. We firmly believe that ethical conduct is the most essential virtual of any academic. Hence any act of plagiarism is totally unacceptable academic misconduct and cannot be tolerated.


For more information, please check at https://www.ieee.org/conferences/organizers/conf-app.html?confRecNum=52353

火狐截图_2020-12-02T06-05-26.757Z.png



Submission Guide

Participation Types

Package A: Only Attendance      

Package B: Abstract Submission+Oral Presentation

Package C: Abstract Submission+Poster Presentation

Package D: Full Paper Publicaiton+Oral/Poster Presentation


For Chinese native speakers,

  If you choose Package D, please submit the full paper (word+pdf) to SUBMISSION SYSTEM

  If you choose Package A, B or C, please register via REGISTRATION SYSTEM .


For English speakers, 

  Please send your full paper or abstract directly to contactecie@163.com.


Note: If you need paper publication, please submit full paper. The author can make an oral/poster presentation after Full Paper is accepted and the payment is finished.

If you need to make oral or poster presentation without publication, please submit abstract only.


Sponsors

  微信图片_20201105110602.png        logo+slogan中英.png         广州计算机学会LOGO.png       

Submission
Registration
Meeting Time

	         
January 22,2021 - January 24,2021
Countdown
活动进行中
Index
EI、Scoups
Contact
Wechat:
Phone:
-086+17737319063
Email:
contactecie@163.com
QQ:
978640953